$399
11/11/2024
Next start date
Online - scheduled
10 Hours to complete
Overview
Begin your journey in the semiconductor industry with the Semiconductor Mechanical Properties, Diffusion, Phase Diagrams, and Heat Treatment Micro-Badge. Delve into the complexities of mechanical properties and discover the significance of diffusion processes, phase diagrams, and heat treatments, essential elements of modern semiconductor technology.
Designed for forward-thinking professionals eager to advance in semiconductor engineering, this micro-badge provides practical skills to excel in a rapidly changing field. Explore topics like mechanical testing, diffusion kinetics, phase diagram analysis, and heat treatment techniques, and leverage cutting-edge knowledge.
Key Skills Covered:
- Mechanical Properties Assessment
- Semiconductor Diffusion Analysis
- Phase Diagram Interpretation
- Heat Treatment Application
Session Topics:
- Mechanical Properties of Metals - The Tensile Test and Failure
- Shape & Property Control of Metals – Diffusion, Dislocations
- Phase Diagrams – Solubility, Eutectic, and Model Phase Diagram
- Microstructure and Properties
- Heat Treatments and Properties
About this course
This course is offered live through Zoom. Instructional sessions will be held:
- Monday, Nov. 11, 2024: 5:30 - 9 p.m. (MST)
- Tuesday, Nov. 12, 2024: 5:30 - 9 p.m. (MST)
- Thursday, Nov. 14, 2024: 5:30 - 8:30 p.m. (MST)
Micro-Badge Level:
Each micro-badge part of this sequence is offered at Level 1. Level 1 micro-badges empower learners to build foundational knowledge, understand broader concepts, key terms, and explanations around specific topics. They provide examples of the use of these concepts across the technology sector.
Learn more about the Ira A. Fulton school of Engineering micro-badge leveling system.
What You’ll Earn:
Participants will earn a full badge within a topic area by completing all four micro-badges within an approved sequence. Badges are offered across many topic areas, aligned to the needs of industry. By completing this badge, participants will also qualify for Continuing Education Units (CEU).
As one of the world's top-ranked engineering schools, the Ira A. Fulton Schools of Engineering is recognized globally as a premier provider of qualifications.
Pre-requisites:
Participants should have a high school education or hold a two-year associate degree. No prior experience in semiconductor packaging is required, making this an accessible entry point for those interested in the field.
Equipment, Software, or Supplies Needed:
- Desktop or Laptop (Windows, Mac, LINUX)
- E-books will be provided
FAQs
Instructors
Dr. Terry Alford
Associate Director and Professor, School for Engineering of Matter, Transport and Energy
Arizona State University
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