Semiconductor Packaging Design and Manufacturing Certificate
Gain a practical, end-to-end understanding of semiconductor packaging—from package anatomy and manufacturing workflows to advanced technologies enabling sub-10nm systems. Learn how packaging supports performance, reliability, and system integration so you can navigate real-world manufacturing challenges, evaluate emerging trends, and prepare for careers shaping the future of electronics.
$799
Total: Course cost
20 - 30 Hours to complete
3 modules
Online - self-paced
Learning modality
Earn a credential
View credential
$799
Total: Course cost
20 - 30 Hours to complete
3 modules
Online - self-paced
Learning modality
Earn a credential
View credential
$799
Total: Course cost
20 - 30 Hours to complete
3 modules
Online - self-paced
Learning modality
Earn a credential
View credential
$799
Total: Course cost
20 - 30 Hours to complete
Duration
Online - self-paced
Overview
This course builds a comprehensive understanding of semiconductor packaging by connecting fundamental concepts, manufacturing processes, and advanced integration technologies. Learners examine how packaging decisions enable modern electronic systems, support scaling beyond the transistor, and address performance, reliability, and system-level challenges in real manufacturing environments.
Emphasis is placed on understanding how packaging design and manufacturing choices impact integration, yield, and long-term system performance.
Expert-Led Live Session
As part of this course, learners are invited to attend a live, online session featuring instructor-led discussion, real-world semiconductor packaging examples, and Q&A. Attendance is optional, and a recording will be available for those unable to join live.
- Tuesday, November 17th, 2026 at 10:00 am (Arizona Time)
This session brings key course concepts to life by exploring the semiconductor packaging process from design through manufacturing and integration. Participants will examine package anatomy, manufacturing workflows, advanced packaging technologies, and the critical role packaging plays in device performance, reliability, thermal management, and heterogeneous integration. Through industry-focused examples and interactive discussion, learners will gain a deeper understanding of how packaging enables today's high-performance semiconductor systems.
Students are encouraged (though not required) to have worked on Modules 1 and 2 before joining the session.
Key Benefits
- Understand package anatomy, functions, and industry-standard terminology
- Analyze end-to-end semiconductor packaging manufacturing workflows and process stages
- Evaluate advanced packaging trends and heterogeneous integration approaches
- Anticipate reliability, scaling, and system integration challenges in modern
What’s Included
- Three structured modules progressing from packaging fundamentals to advanced integration technologies
- Step-by-step coverage of assembly, testing, and process control systems used in semiconductor manufacturing
- Industry-aligned assessments based on real-world packaging and integration scenarios
- Exams and quizzes reinforcing applied technical concepts and terminology
By the end of the course, you’ll be equipped to engage confidently with semiconductor packaging technologies and career opportunities shaping next-generation electronic systems.
Course Modules
Who this course is designed for
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Engineering students, early-career professionals, and technicians interested in the semiconductor industry
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Individuals focused on semiconductor packaging, manufacturing, or advanced electronics
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Learners seeking practical insight into package design, assembly processes, and emerging integration technologies
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Those pursuing careers in semiconductor manufacturing, process engineering, reliability, or advanced packaging
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Anyone looking to build industry-relevant knowledge and technical fluency in semiconductor packaging
Outcomes
By the end of this course, you’ll be able to:
- Examine and apply fundamental concepts and terminology used in the semiconductor packaging industry
- Analyze the disciplines and processes involved in modern semiconductor packaging technologies
- Anticipate future challenges related to scaling, reliability, and system integration
- Identify and evaluate career pathways in semiconductor packaging, manufacturing, and advanced
Practical skills you will develop
This program equips learners with vital skills to thrive in today's complex workforce. Key skills include:
Program support
Have additional questions?
Please reach out directly to exec-fseonline@asu.edu for program related questions.
Connect with our team
Complete a brief form to get program recommendations and answers to your questions.